Patent Assignment
Reel/Frame 050924/0301
Assignment of Assignor's Interest
Recorded: 2019-11-06
Pages: 6
Assignors
WU, ZHIYUAN
Executed: 2018-08-15
TSENG, MENG CHU
Executed: 2018-08-15
NAIK, MEHUL B.
Executed: 2018-08-15
SHEU, BEN-LI
Executed: 2019-11-05
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Seed Layers for Copper Interconnects