Patent Assignment
Reel/Frame 050924/0838
Assignment of Assignor's Interest
Recorded: 2019-11-06
Pages: 8
Assignors
OYAMADA, TETSUYA
Executed: 2018-12-25
UNO, TOMOHIRO
Executed: 2018-12-25
YAMADA, TAKASHI
Executed: 2018-12-28
ODA, DAIZO
Executed: 2018-12-28
ETO, MOTOKI
Executed: 2018-12-27
Assignees
NIPPON STEEL CHEMICAL & MATERIAL CO., LTD.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU, TOKYO, 101-0021, JAPAN
NIPPON MICROMETAL CORPORATION
158-1 OAZA SAYAMAGAHARA, IRUMA-SHI, SAITAMA, 358-0032, JAPAN
Covered Property
(1)
Bonding Wire for Semiconductor Device
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.