Patent Assignment
Reel/Frame 050957/0149
Assignment of Assignor's Interest
Recorded: 2019-11-08
Pages: 4
Assignors
LU, TSUNG-HSING
Executed: 2019-09-06
HE, JUN
Executed: 2019-09-10
CHU, LI-HUAN
Executed: 2019-09-09
TSAO, PEI-HAW
Executed: 2019-09-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Dicing Method for Stacked Semiconductor Devices