Patent Assignment
Reel/Frame 050968/0822
Assignment of Assignor's Interest
Recorded: 2019-11-11
Pages: 7
Assignors
PARK, KWANG WUK
Executed: 2019-10-28
CHO, SUNG DONG
Executed: 2019-10-30
KIM, EUN JI
Executed: 2019-10-25
LEE, HAK SEUNG
Executed: 2019-10-25
LEE, DAE SUK
Executed: 2019-10-25
LIM, DONG CHAN
Executed: 2019-10-25
PARK, SANG JUN
Executed: 2019-10-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Device Including Tsv and Method of Manufacturing the Same