Semiconductor device including TSV and method of manufacturing the same

1. A semiconductor device comprising:

a substrate;

an interlayer insulating layer on the substrate;

a etch adjusting layer on the substrate;

a first through-silicon-via (TSV) configured to pass through the substrate, the interlayer insulating layer, and the etch adjusting layer; and

a second TSV configured to pass through the substrate and the interlayer insulating layer,

wherein the first TSV and the second TSV have different widths, and

wherein the etch adjusting layer comprises a material having a different etch selectivity with respect to the interlayer insulating layer and the substrate.

2. The semiconductor device of claim 1 , wherein the first TSV has a width greater than that of the second TSV and the material of the etch adjusting layer has a lower etch rate with respect to the interlayer insulating layer and the substrate.

3. The semiconductor device of claim 1 , wherein the first TSV has a width less than that of the second TSV and the material of the etch adjusting layer has a higher etch rate with respect to the interlayer insulating layer and the substrate.

4. The semiconductor device of claim 1 , wherein the width of the second TSV is about 1.3 to 1.7 times the width of the first TSV and a width of the etch adjusting layer is about 0.1 to 1 times the first TSV.

5. The semiconductor device of claim 1 , wherein an inner side surface of the etch adjusting layer contacts a portion of an outer side surface of the first TSV, and the etch adjusting layer is in the interlayer insulating layer.

6. The semiconductor device of claim 1 , wherein the interlayer insulating layer comprises a first interlayer insulating layer and a second interlayer insulating layer, which are alternately stacked and comprise different materials; and

wherein outer side surfaces of the first TSV and the second TSV, which are in contact with an inner side surface of the interlayer insulating layer, each have an irregular shape comprising at least one protrusion.

7. The semiconductor device of claim 1 , wherein an inner side surface of the etch adjusting layer contacts a portion of an outer side surface of the first TSV, a bottom surface and an outer side surface thereof are in contact with the substrate, and an upper surface thereof is in contact with the interlayer insulating layer.

8. The semiconductor device of claim 7 , wherein the semiconductor device further comprises:

a first through-hole in which the first TSV is received and which is configured to pass through the substrate, the interlayer insulating layer, and the etch adjusting layer; and

a second through-hole in which the second TSV is received and which is configured to pass through the substrate and the interlayer insulating layer,

wherein the first through-hole comprises a first undercut region formed between the etch adjusting layer and the substrate.

9. The semiconductor device of claim 8 , wherein the second through-hole further comprises a second undercut region formed between the etch adjusting layer and the substrate, and

wherein the second undercut region is located at a higher level than the first undercut region in cross-sectional view with the substrate being a lowest reference level.

10. The semiconductor device of claim 1 , wherein the substrate comprises an inner side surface in contact with an outer side surface of the first TSV, and

wherein the inner side surface of the substrate further comprises an overhang protruding toward an inner side of the first TSV.

11. A semiconductor device comprising:

a substrate;

an interlayer insulating layer on the substrate;

a first etch adjusting layer and a second etch adjusting layer on the substrate;

a first through-silicon-via (TSV) configured to pass through the substrate, the interlayer insulating layer, and the first etch adjusting layer; and

a second TSV configured to pass through the substrate, the interlayer insulating layer, and the second etch adjusting layer,

wherein the second TSV has a width greater than that of the first TSV,

wherein the first etch adjusting layer and the second etch adjusting layer comprise first and second materials, respectively, having different respective etch selectivities with respect to the interlayer insulating layer and the substrate,

wherein the first material of the first etch adjusting layer has a higher etch rate with respect to the interlayer insulating layer and the substrate, and

wherein the second material of the second etch adjusting layer has a lower etch rate with respect to the interlayer insulating layer and the substrate.

12. The semiconductor device of claim 11 , wherein the first material of the first etch adjusting layer and the second material of the second etch adjusting layer comprise first and second insulating materials, respectively, the first and second insulating materials having different thicknesses.

13. The semiconductor device of claim 11 , wherein the first etch adjusting layer and the second etch adjusting layer are positioned at a same level in a cross-sectional view with the substrate being a lowest reference level.

14. The semiconductor device of claim 13 , wherein the first etch adjusting layer and the second etch adjusting layer are in the interlayer insulating layer.

15. The semiconductor device of claim 13 , wherein the first etch adjusting layer and the second etch adjusting layer each have a bottom surface and an outer side surface, which are in contact with the substrate, and an upper surface which is in contact with the interlayer insulating layer.

16. The semiconductor device of claim 11 , wherein the first etch adjusting layer and the second etch adjusting layer are positioned at different levels in a cross-sectional view with the substrate being a lowest reference level.

17. The semiconductor device of claim 11 , wherein the first etch adjusting layer and the second etch adjusting layer are in the interlayer insulating layer; and

wherein a bottom surface of the first etch adjusting layer or a bottom surface of the second etch adjusting layer is in contact with an upper surface of the substrate.

18. The semiconductor device of claim 16 , wherein one of the first etch adjusting layer and the second etch adjusting layer is in the interlayer insulating layer and the first etch adjusting layer or the second etch adjusting layer not in the interlayer insulating layer has a bottom surface and an outer side surface, which are in contact with the substrate, and an upper surface, which is in contact with the interlayer insulating layer.

19. The semiconductor device of claim 16 , wherein one of the first etch adjusting layer and the second etch adjusting layer is in the interlayer insulating layer and the first etch adjusting layer or the second etch adjusting layer not in the interlayer insulating layer is on the interlayer insulating layer.

20. A semiconductor device comprising:

a substrate;

an interlayer insulating layer on the substrate;

a etch adjusting layer on the substrate;

a first through-silicon-via (TSV) configured to pass through the substrate and the interlayer insulating layer; and

a second TSV configured to pass through the substrate, the interlayer insulating layer and the etch adjusting layer,

wherein the second TSV has a width greater than that of the first TSV, and

wherein the etch adjusting layer comprises a material having a lower etch rate with respect to the interlayer insulating layer and the substrate.

21. The semiconductor device of claim 20 , wherein the etch adjusting layer is on the interlayer insulating layer, and

wherein the semiconductor device further comprises:

a metal interlayer insulating layer on the interlayer insulating layer and the etch adjusting layer; and

a metal layer connected to each of the first TSV and the second TSV in the metal interlayer insulating layer.