IP Library › Assignment 050969/0286
Patent Assignment
Reel/Frame 050969/0286

Assignment of Assignor's Interest

Recorded: 2019-11-11 Pages: 3
Assignors
YANG, YI
Executed: 2018-02-13
TENG, ZHONGJIAN
Executed: 2018-02-13
HAQ, JESMIN
Executed: 2018-02-13
WANG, YU-JEN
Executed: 2018-02-13
Assignee
HEADWAY TECHNOLOGIES, INC
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property (1)
Fabrication of Large Height Top Metal Electrode for Sub-60nm Magnetoresistive Random Access Memory (MRAM) Devices
Application: 16/679,508 →
Publication: US 2020/0075847
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 11, 2019
From: HEADWAY TECHNOLOGIES, INC.
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 050969/0476 →