Patent Assignment
Reel/Frame 050969/0476
Assignment of Assignor's Interest
Recorded: 2019-11-11
Pages: 20
Assignor
HEADWAY TECHNOLOGIES, INC.
Executed: 2019-02-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Fabrication of Large Height Top Metal Electrode for Sub-60nm Magnetoresistive Random Access Memory (MRAM) Devices
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.