Patent Assignment
Reel/Frame 050970/0569
Assignment of Assignor's Interest
Recorded: 2019-11-11
Pages: 6
Assignors
HAQ, JESMIN
Executed: 2018-04-12
ZHONG, TOM
Executed: 2018-04-12
LAM, VINH
Executed: 2018-04-12
SUNDAR, VIGNESH
Executed: 2018-04-12
TENG, ZHONGJIAN
Executed: 2018-04-12
Assignee
HEADWAY TECHNOLOGIES, INC.
678 S. HILLVIEW DRIVE, MILPITAS, CALIFORNIA, 95035
Covered Property
(1)
MTJ Device Performance by Adding Stress Modulation Layer to MTJ Device Structure
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.