Patent Assignment
Reel/Frame 050976/0056
Assignment of Assignor's Interest
Recorded: 2019-11-11
Pages: 4
Assignors
CHEN, MING-HUNG
Executed: 2019-08-30
YEH, YUNG I.
Executed: 2019-08-30
YEH, CHANG-LIN
Executed: 2019-08-30
CHEN, SHENG-YU
Executed: 2019-08-30
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same