Patent Assignment
Reel/Frame 050988/0868
Assignment of Assignor's Interest
Recorded: 2019-11-13
Pages: 4
Assignors
ALBERT, SVEN
Executed: 2019-11-04
BOETTCHER, RENÉ
Executed: 2019-11-04
BÖHM, ALEXANDER
Executed: 2019-11-04
LINDNER, MIKE
Executed: 2019-11-04
SCHMIDT, THOMAS
Executed: 2019-09-27
Assignee
3D-MICROMAC AG
TECHNOLOGIE-CAMPUS 8, CHEMNITZ, 09126, GERMANY
Covered Property
(1)
Method of Producing Microelectronic Components with a Layer Structure