Patent Assignment
Reel/Frame 050992/0608
Assignment of Assignor's Interest
Recorded: 2019-11-13
Pages: 3
Assignors
CHIANG, KUO-CHENG
Executed: 2019-09-08
TSAI, CHING-WEI
Executed: 2019-09-10
LIU, CHI-WEN
Executed: 2019-09-18
LEUNG, YING-KEUNG
Executed: 2019-09-17
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Properties
(4)
Devices Including Gate Spacer with Gap or Void and Methods of Forming the Same
Devices Including Gate Spacer with Gap or Void and Methods of Forming the Same
Devices Including Gate Spacer with Gap or Void and Methods of Forming the Same
Devices Including Gate Spacer with Gap or Void and Methods of Forming the Same
Related Assignments
(1)
Other recorded transfers of the patents in this record — the chain of ownership.