Patent Assignment
Reel/Frame 051013/0240
Assignment of Assignor's Interest
Recorded: 2019-11-14
Pages: 5
Assignors
TEH, CHEE HAK
Executed: 2019-06-28
LEONG, CHEE SENG
Executed: 2019-06-29
TANG, LAI GUAN
Executed: 2019-06-28
LIM, HAN WOOI
Executed: 2019-06-28
PHOON, HEE KONG
Executed: 2019-06-28
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Fabric Die to Fabric Die Interconnect for Modularized Integrated Circuit Devices
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.