Patent Assignment
Reel/Frame 051042/0948
Assignment of Assignor's Interest
Recorded: 2019-11-18
Pages: 3
Assignors
SHEN, HONG
Executed: 2016-05-10
WANG, LIANG
Executed: 2016-05-10
GAO, GUILIAN
Executed: 2016-05-10
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
System and Method for Providing 3D Wafer Assembly with Known-Good-Dies
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Certificate of Conversion & Change of Name
Apr 4, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 059581/0435 →
Change of Name
Sep 1, 2023
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 064803/0765 →