Patent Assignment
Reel/Frame 051058/0846
Assignment of Assignor's Interest
Recorded: 2019-11-19
Pages: 2
Assignor
HAGIMOTO, YOSHIYA
Executed: 2019-10-08
Assignee
SONY SEMICONDUCTOR SOLUTIONS CORPORATION
4-14-1 ASAHI-CHO, ATSUGI-SHI, KANAGAWA, 2430014, JAPAN
Covered Property
(1)
Semiconductor Device with a Through Electrode Reception Part Wider than a Through Electrode, Solid-State Imaging Device, and Electronic Equipment