IP Library › Assignment 051067/0147
Patent Assignment
Reel/Frame 051067/0147

Assignment of Assignor's Interest

Recorded: 2019-11-20 Pages: 3
Assignors
TSAI, CHENG-HSIUNG
Executed: 2019-11-14
AGARWAL, PRASHANT
Executed: 2019-11-04
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Method and Apparatus for Processing a Substrate Using Non-Contact Temperature Measurement
Application: 16/545,537 →
Publication: US 2021/0057244
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Jan 6, 2020
From: RAMACHANDRAN, VINODH; JUPUDI, ANANTHKRISHNA; OW, YUEH SHENG; RAO, PREETHAM P.
To: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
Reel/Frame 051421/0141 →
Assignment of Assignor's Interest Aug 10, 2020
From: APPLIED MATERIALS SINGAPORE TECHNOLOGY PTE. LTD.
To: APPLIED MATERIALS, INC.
Reel/Frame 053444/0044 →