Method and apparatus for processing a substrate using non-contact temperature measurement
Methods and apparatus for processing a substrate are provided. The apparatus, for example, can include a process chamber comprising a chamber body defining a processing volume and having a view port coupled to the chamber body; a substrate support disposed within the processing volume and having a support surface to support a substrate; and an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the view port to measure a temperature of the substrate when being processed in the processing volume, the IRTS movable relative to the view port for scanning the substrate through the view port.
1. An apparatus for processing a substrate, comprising:
a process chamber comprising a chamber body defining a processing volume and having a view port coupled to the chamber body;
a substrate support disposed within the processing volume and having a support surface to support a substrate; and
an infrared temperature sensor (IRTS) disposed outside the chamber body adjacent the view port to measure a temperature of the substrate when being processed in the processing volume, the IRTS movable relative to the view port for scanning the substrate through the view port,
wherein an angle of incidence of a beam, output from the IRTS for scanning the substrate, relative to the substrate creates an elliptical field of view.
2. The apparatus of claim 1 , wherein the IRTS is located at a position relative to the view port such that a field of view of the IRTS is always less than a diameter of an aperture defined in the processing volume of the chamber body.
3. The apparatus of claim 2 , wherein the diameter of the aperture does not exceed one quarter of a wavelength of energy used to process the substrate.
4. The apparatus of claim 1 , wherein the IRTS is mounted on a bracket coupled to a side of the chamber body and is movable in a vertical direction along the bracket.
5. The apparatus of claim 1 , wherein the process chamber is a microwave chamber.
6. The apparatus of claim 1 , further comprising a controller that is operably coupled to the IRTS and a power source used for processing the substrate,
wherein the controller receives an input from the IRTS in response to scanning the substrate and analyzes the input for controlling the power source such that the temperature of the substrate does not exceed a threshold while the substrate is being processed.
7. The apparatus of claim 1 , wherein the substrate support comprises a plurality of support surfaces for receiving and supporting a corresponding plurality of substrates.
8. The apparatus of claim 1 , further comprising a metal plate that is positioned adjacent the view port, the metal plate including at least one aperture that is configured to direct a beam output from the IRTS for scanning the substrate through the view port.
9. A method for substrate packaging comprising:
positioning a substrate on a support surface of a substrate support disposed within a processing volume of a process chamber comprising a chamber body and a view port coupled to the chamber body;
providing an infrared temperature sensor (IRTS) outside of the chamber body adjacent the view port;
moving the IRTS relative to the view port to scan the substrate through the view port; and
measuring a temperature of the substrate while the substrate is being processed in the processing volume,
wherein scanning the substrate comprises outputting a beam from the IRTS at an angle of incidence relative to the substrate that creates an elliptical field of view.
10. The method of claim 9 , wherein the IRTS is located at a position relative to the view port such that a field of view of the IRTS is always less than a diameter of an aperture defined in the processing volume of the chamber body.
11. The method of claim 10 , wherein the diameter of the aperture does not exceed one quarter of a wavelength of energy used to process the substrate.
12. The method of claim 9 , wherein moving the IRTS comprises moving the IRTS in a vertical direction along a bracket coupled to a side of the chamber body.
13. The method of claim 9 , further comprising receiving, at a controller that is operably coupled to the IRTS and a power source used for processing the substrate, an input from the IRTS in response to scanning the substrate and analyzing the input for controlling the power source such that the temperature of the substrate does not exceed a threshold while the substrate is being processed.
14. The method of claim 9 , wherein scanning the substrate through the view port comprises scanning a plurality of substrates.
15. The method of claim 9 , wherein scanning the substrate through the view port comprises directing a beam through at least one aperture defined through a metal plate that is positioned adjacent the view port.
16. A non-transitory computer readable storage medium having stored thereon instructions that when executed by a processor cause the processor to perform a method for substrate packaging comprising:
positioning a substrate on a support surface of a substrate support disposed within a processing volume of a process chamber comprising a chamber body and a view port coupled to the chamber body;
providing an infrared temperature sensor (IRTS) outside of the chamber body adjacent the view port;
moving the IRTS relative to the view port to scan the substrate through the view port; and
measuring a temperature of the substrate while the substrate is being processed in the processing volume,
wherein scanning the substrate comprises outputting a beam from the IRTS at an angle of incidence relative to the substrate that creates an elliptical field of view.
17. The non-transitory computer readable storage medium of claim 16 , wherein moving the IRTS comprises moving the IRTS in a vertical direction along a bracket coupled to a side of the chamber body.