Patent Assignment
Reel/Frame 051070/0289
Assignment of Assignor's Interest
Recorded: 2019-11-21
Pages: 3
Assignor
NAGASAWA, HIDEO
Executed: 2019-11-06
Assignee
MOLEX, LLC
2222 WELLINGTON COURT, LISLE, ILLINOIS, 60532
Covered Properties
(2)
Socket Interconnector for High Pad Count Memory Cards
Socket Interconnector for High Pad Count Memory Cards
Application:
62/807,395 →
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jun 12, 2019
From: BURKE, JOHN
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 049446/0738 →
Security Interest
Feb 6, 2020
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS AGENT
Reel/Frame 052915/0566 →
Release of Security Interest at Reel 052915 Frame 0566
Feb 8, 2022
From: JPMORGAN CHASE BANK, N.A.
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 059127/0001 →
Patent Collateral Agreement - a&R Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 064715/0001 →
Patent Collateral Agreement - Ddtl Loan Agreement
Aug 21, 2023
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A.
Reel/Frame 067045/0156 →
Assignment of Assignor's Interest
Sep 14, 2023
From: MOLEX, LLC
To: WESTERN DIGITAL TECHNOLOGIES, INC.
Reel/Frame 064911/0195 →
Assignment of Assignor's Interest
May 29, 2024
From: WESTERN DIGITAL TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067567/0682 →
Change of Name
Jun 27, 2024
From: SANDISK TECHNOLOGIES, INC.
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 067982/0032 →
Patent Collateral Agreement
Aug 23, 2024
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS THE AGENT
Reel/Frame 068762/0494 →
Assignment of Assignor's Interest
Apr 8, 2025
From: SANDISK TECHNOLOGIES, INC.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 070776/0307 →