Patent Assignment
Reel/Frame 051110/0917
Assignment of Assignor's Interest
Recorded: 2019-11-25
Pages: 4
Assignors
MEHTA, VIPUL
Executed: 2019-07-10
BAI, YIQUN
Executed: 2019-07-29
LIN, ZIYIN
Executed: 2019-07-10
DECKER, JOHN
Executed: 2019-07-24
LI, YAN
Executed: 2019-07-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Trenches in Wafer Level Packages for Improvements in Warpage Reliability and Thermals
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.