Trenches in wafer level packages for improvements in warpage reliability and thermals
Embodiments disclosed herein include composite dies and methods of forming such composite dies. In an embodiment, a composite die comprises a base substrate, a first die over the base substrate, and a second die over the base substrate and adjacent to the first die. In an embodiment an underfill layer is between the first die and the base substrate, between the second die and the base substrate, and between the first die and the second die. In an embodiment, a trench into the underfill layer is between the first die and the second die. In an embodiment the composite die further comprises, a mold layer over the first die and the second die, wherein the mold layer fills the trench.
1. A composite die, comprising:
a base substrate;
a first die over the base substrate, the first die having a first sidewall laterally opposite a second sidewall;
a second die over the base substrate and adjacent to the first die, the second die having a first sidewall laterally opposite a second sidewall, wherein the first sidewall of the second die faces the second sidewall of the first die;
an underfill layer between the first die and the base substrate, between the second die and the base substrate, and between the first die and the second die, and wherein a trench into the underfill layer is between the first die and the second die; and
a mold layer in contact with the first sidewall of the first die and in contact with the second sidewall of the second die, wherein the mold layer fills the trench.
2. The composite die of claim 1 , wherein a depth of the trench is less than a thickness of the first die and a thickness of the second die.
3. The composite die of claim 1 , wherein a depth of the trench is greater than a thickness of the first die and a thickness of the second die.
4. The composite die of claim 3 , wherein the trench passes entirely through the underfill layer.
5. The composite die of claim 1 , wherein the trench has a tapered profile.
6. The composite die of claim 1 , wherein a top surface of the underfill layer is substantially coplanar with a top surface of the first die and the second die.
7. The composite die of claim 1 , wherein the base substrate is a passive substrate or an active substrate.
8. The composite die of claim 1 , wherein the trench surrounds the first die and the second die.
9. The composite die of claim 1 , wherein a coefficient of thermal expansion (CTE) of the mold layer is lower than the CTE of the underfill layer.
10. The composite die of claim 9 , wherein the CTE of the mold layer is less than approximately 10 parts per million per degree Celsius (ppm/C).
11. The composite die of claim 1 , wherein a thermal conductivity of the mold layer is approximately 2.5 W/mK or greater.
12. A method of forming a composite die, comprising:
attaching a plurality of dies to a surface of a base substrate, the plurality of dies comprising pairs of neighboring dies, each pair of neighboring dies comprising a first die having a first sidewall laterally opposite a second sidewall, and a second die having a first sidewall laterally opposite a second sidewall, wherein the first sidewall of the second die faces the second sidewall of the first die;
disposing an underfill layer under and around the plurality of dies;
forming a trench into the underfill layer, wherein the trench is between neighboring dies of the plurality of dies;
disposing a mold layer on the plurality of dies, the mold layer in contact with the first sidewall of the first die and in contact with the second sidewall of the second die of each pair of neighboring dies, wherein the mold layer fills the trench; and
singulating the plurality of dies into a plurality of composite dies.
13. The method of claim 12 , wherein each of the plurality of composite dies comprises:
the first die;
the second die;
a portion of the base substrate; and
a portion of the trench between the first die and the second die.
14. The method of claim 12 , wherein the trench is formed after curing the underfill layer.
15. The method of claim 12 , wherein the trench is formed with a laser.
16. The method of claim 15 , wherein a profile of the trench is tapered.
17. The method of claim 12 , further comprising:
planarizing the mold layer, wherein a top surface of the mold layer, top surfaces of the plurality of dies, and a top surface of the underfill layer are substantially coplanar with each other after the planarizing.
18. The method of claim 12 , further comprising:
assembling each of the plurality of composite dies into different ones of a plurality of electronic packages.
19. The method of claim 12 , wherein the coefficient of thermal expansion (CTE) of the mold layer is lower than the CTE of the underfill layer.
20. An electronic package, comprising:
a package substrate; and
a composite die electrically coupled to the package substrate, wherein the composite die comprises:
a base substrate;
a plurality of dies over the package substrate, wherein the plurality of dies comprises a first die having a first sidewall laterally opposite a second sidewall, and a second die having a first sidewall laterally opposite a second sidewall, wherein the first sidewall of the second die faces the second sidewall of the first die;
an underfill layer under and around the plurality of dies; and
a trench into the underfill layer, wherein the trench is between a first die and a second die of the plurality of dies; and
a mold layer on the plurality of dies, the mold layer in contact with the first sidewall of the first die and in contact with the second sidewall of the second die, wherein the mold layer fills the trench.
21. The electronic package of claim 20 , further comprising:
an integrated heat spreader (IHS) thermally coupled to the composite die by a thermal interface material (TIM) layer.
22. The electronic package of claim 21 , wherein a thermal path with the least thermal resistance from the base substrate to the IHS passes through the trench.
23. The electronic package of claim 20 , further comprising:
a third die attached to the package substrate.
24. The electronic package of claim 20 , wherein the trench has a tapered profile.
25. The electronic package of claim 20 , further comprising:
a board, wherein the package substrate is electrically coupled to the board.
26. A composite die, comprising:
a base substrate;
a first die over the base substrate;
a second die over the base substrate and adjacent to the first die;
an underfill layer between the first die and the base substrate, between the second die and the base substrate, and between the first die and the second die, wherein a trench into the underfill layer is between the first die and the second die, and wherein the trench has a tapered profile; and
a mold layer over the first die and the second die, wherein the mold layer fills the trench.
27. A composite die, comprising:
a base substrate;
a first die over the base substrate;
a second die over the base substrate and adjacent to the first die;
an underfill layer between the first die and the base substrate, between the second die and the base substrate, and between the first die and the second die, and wherein a trench into the underfill layer is between the first die and the second die; and
a mold layer over the first die and the second die, wherein the mold layer fills the trench, wherein a coefficient of thermal expansion (CTE) of the mold layer is lower than the CTE of the underfill layer.