Patent Assignment
Reel/Frame 051113/0814
Assignment of Assignor's Interest
Recorded: 2019-11-25
Pages: 3
Assignors
LIN, ZIYIN
Executed: 2019-08-27
NOFEN, ELIZABETH
Executed: 2019-08-27
MEHTA, VIPUL
Executed: 2019-08-27
GAINES, TAYLOR
Executed: 2019-08-27
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Semiconductor Die Package with Warpage Management and Process for Forming Such
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.