Patent Assignment
Reel/Frame 051127/0824
Assignment of Assignor's Interest
Recorded: 2019-11-27
Pages: 3
Assignor
CHO, EUNG SAN
Executed: 2019-10-30
Assignee
INFINEON TECHNOLOGIES AMERICAS CORP.
101 N. SEPULVEDA BLVD., EL SEGUNDO, CALIFORNIA, 90245
Covered Property
(1)
Semiconductor Package and Method of Fabricating a Semiconductor Package
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 27, 2019
From: DINKEL, MARKUS; PALM, PETTERI; HOEGLAUER, JOSEF; OTREMBA, RALF
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 051127/0898 →
Assignment of Assignor's Interest
Jun 25, 2020
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 053033/0077 →