Semiconductor package and method of fabricating a semiconductor package
In an embodiment, a semiconductor package includes a package footprint having a plurality of solderable contact pads, a semiconductor device having a first power electrode and a control electrode on a first surface and a second power electrode on a second surface, a redistribution substrate having an insulating board, wherein the first power electrode and the control electrode are mounted on a first major surface of the insulating board and the solderable contact pads of the package footprint are arranged on a second major surface of the insulating board, and a contact clip having a web portion and one or more peripheral rim portions. The web portion is mounted on and electrically coupled to the second power electrode and the peripheral rim portion is mounted on the first major surface of the insulating board.
1. A semiconductor package, comprising:
a package footprint comprising a plurality of solderable contact pads;
a semiconductor device comprising a first power electrode and a control electrode on a first surface and a second power electrode on a second surface opposite the first surface;
a redistribution substrate comprising an insulating board having a first major surface and a second major surface, wherein the first power electrode and the control electrode of the semiconductor device are mounted on the first major surface of the insulating board and the solderable contact pads of the package footprint are arranged on the second major surface of the insulating board; and
a contact clip comprising a web portion and one or more peripheral rim portions, wherein the web portion is mounted on and electrically coupled to the second power electrode of the semiconductor device and the peripheral rim portion is mounted on the first major surface of the insulating board,
wherein the insulating board comprises an aperture extending from the first major surface to the second major surface,
wherein the first power electrode or the control electrode of the semiconductor device or the peripheral rim portion of the contact clip forms a base of the aperture,
wherein the first power electrode and the control electrode of the semiconductor device are mounted on and electrically insulated from the first major surface of the insulating board by an insulating adhesive.
2. The semiconductor package of claim 1 , wherein the contact clip comprises two peripheral rim portions extending from opposing sides of the web portion.
3. The semiconductor package of claim 1 , wherein the redistribution substrate further comprises at least one conductive via extending from the first major surface to the second major surface and electrically coupling a conductive pad on the first major surface with at least one of the plurality of solderable outer contact pads on the second major surface.
4. The semiconductor package of claim 1 , wherein the peripheral rim portion of the contact clip is mounted on and electrically coupled to a conductive pad on the first major surface of the insulating board.
5. The semiconductor package of claim 4 , wherein the peripheral rim portion of the contact clip is mounted on and electrically coupled to the conductive pad on the first major surface of the insulating board by solder, and wherein the solder comprises a melting point of greater than 230° C. or of 260° C. or greater.
6. The semiconductor package of claim 1 , further comprising solder positioned on the peripheral rim portion and on at least side faces of the aperture, and wherein the solder electrically connects the peripheral rim portion to a solderable contact pad on the second major surface of the insulating board.
7. The semiconductor package of claim 1 , further comprising a further semiconductor device electrically coupled with the semiconductor device by the contact clip to form a circuit.
8. The semiconductor package of claim 7 , wherein the further semiconductor device comprises a freewheeling diode or a transistor coupled in a half bridge configuration with the semiconductor device.