IP Library Assignment 051127/0898
Patent Assignment
Reel/Frame 051127/0898

Assignment of Assignor's Interest

Recorded: 2019-11-27 Pages: 4
Assignors
DINKEL, MARKUS
Executed: 2019-11-05
PALM, PETTERI
Executed: 2019-11-07
HOEGLAUER, JOSEF
Executed: 2019-10-31
OTREMBA, RALF
Executed: 2019-11-04
SCHNOY, FABIAN
Executed: 2019-11-07
Assignee
INFINEON TECHNOLOGIES AUSTRIA AG
SIEMENSSTRASSE 2, VILLACH, 9500, AUSTRIA
Covered Property (1)
Semiconductor Package and Method of Fabricating a Semiconductor Package
Application: 16/668,038 →
Publication: US 2020/0135619
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Nov 27, 2019
From: CHO, EUNG SAN
To: INFINEON TECHNOLOGIES AMERICAS CORP.
Reel/Frame 051127/0824 →
Assignment of Assignor's Interest Jun 25, 2020
From: INFINEON TECHNOLOGIES AMERICAS CORP.
To: INFINEON TECHNOLOGIES AUSTRIA AG
Reel/Frame 053033/0077 →