Patent Assignment
Reel/Frame 051136/0981
Assignment of Assignor's Interest
Recorded: 2019-11-28
Pages: 4
Assignors
LEE, TZUNG-HUI
Executed: 2019-11-19
KUO, HUNG-JUI
Executed: 2019-11-19
HO, MING-CHE
Executed: 2019-11-19
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Structure and Method of Fabricating the Same