Patent Assignment
Reel/Frame 051163/0436
Assignment of Assignor's Interest
Recorded: 2019-12-03
Pages: 7
Assignors
SETHURAMAN, SARAVANAN
Executed: 2019-11-22
MORRIS, TONIA
Executed: 2019-12-02
LAI, SIAW KANG
Executed: 2019-11-25
LIM, YEE CHOONG
Executed: 2019-11-25
ONG, YU YING
Executed: 2019-11-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Methods and Apparatus for Managing Thermal Behavior in Multichip Packages
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.