Patent Assignment
Reel/Frame 051166/0363
Assignment of Assignor's Interest
Recorded: 2019-12-03
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Electronic Device Package and Method for Manufacturing the Same