Patent Assignment
Reel/Frame 051206/0015
Assignment of Assignor's Interest
Recorded: 2019-12-06
Pages: 4
Assignor
KAMEI, KOJI
Executed: 2019-11-29
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC EPITAXIAL WAFER AND METHOD FOR MANUFACTURING SAME
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.