Patent Assignment
Reel/Frame 051267/0348
Assignment of Assignor's Interest
Recorded: 2019-12-12
Pages: 8
Assignors
RUBIN, JOSHUA M.
Executed: 2019-12-12
KUMAR, ARVIND
Executed: 2019-12-12
CLEVENGER, LAWRENCE A.
Executed: 2019-12-11
WRIGHT, STEVEN LORENZ
Executed: 2019-12-11
BECKER, WIREN
Executed: 2019-12-11
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Multi-Chip Package Structure Having High Density Chip Interconnect Bridge with Embedded Power Distribution Network
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.