Patent Assignment
Reel/Frame 051267/0356
Assignment of Assignor's Interest
Recorded: 2019-12-12
Pages: 3
Assignor
LIU, XIAO HU
Executed: 2000-07-31
Assignee
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD, ARMONK, NEW YORK, 10504
Covered Property
(1)
Multi-Chip Package Structure Having High Density Chip Interconnect Bridge with Embedded Power Distribution Network
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.