Patent Assignment
Reel/Frame 051267/0826
Assignment of Assignor's Interest
Recorded: 2019-12-12
Pages: 3
Assignee
INVENSAS CORPORATION
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstituted Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Jun 8, 2022
From: INVENSAS CORPORATION
To: INVENSAS LLC
Reel/Frame 060314/0827 →
Change of Name
Oct 23, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073238/0665 →