Multi-chip modules formed using wafer-level processing of a reconstituted wafer
Apparatuses and methods are described. This apparatus includes a bridge die having first contacts on a die surface being in a molding layer of a reconstituted wafer. The reconstituted wafer has a wafer surface including a layer surface of the molding layer and the die surface. A redistribution layer on the wafer surface includes electrically conductive and dielectric layers to provide conductive routing and conductors. The conductors extend away from the die surface and are respectively coupled to the first contacts at bottom ends thereof. At least second and third IC dies respectively having second contacts on corresponding die surfaces thereof are interconnected to the bridge die and the redistribution layer. A first portion of the second contacts are interconnected to top ends of the conductors opposite the bottom ends thereof in part for alignment of the at least second and third IC dies to the bridge die.
1. A method, comprising:
providing a first die in a reconstituted form in which the first die is at least partially surrounded by a first molding layer, a pad layer disposed over the first die and including at least one contact;
providing at least one second die at least partially surrounded by a second molding layer and directly bonded to the first die by way of a direct bonded interconnect, the at least one second die including at least one contact directly bonded and in contact with the at least one contact of the pad layer without an intervening solder ball; and
forming at least one conductor through the first molding layer, the least one conductor being in contact with the second die.
2. The method according to claim 1 , wherein the first die is a bridging die between the second die and a third die in a reconstituted form.
3. The method according to claim 2 , wherein the second die and the third die partially overlap a facing surface of the first die.
4. The method according to claim 3 , wherein the at least one conductor is a through-mold via.
5. The method according to claim 4 , wherein the first molding_layer has thereon a compliant layer having a surface aligned to an end of the through-mold via.
6. The method according to claim 4 , wherein a redistribution layer couples the at least one conductor for electrical conductivity with the second die.
7. The method according to claim 4 , wherein the at least one second die comprises fine-pitch contacts.
8. An apparatus, comprising:
a first die at least partially surrounded by a first molding layer, a pad layer disposed over the first die and including at least one contact;
a second die with a second molding layer along at least one side surface of the second die, the second die directly bonded to the first die by way of a direct bonded interconnect, the second die including at least one contact directly bonded and in contact with the at least one contact of the pad layer without an intervening solder ball; and
at least one conductor through the first molding layer, the least one conductor being in contact with the second die.
9. The apparatus according to claim 8 , wherein the first die is a bridging die between the second die and a third die in a reconstituted form.
10. The apparatus according to claim 9 , wherein the second die and the third die partially overlap a facing surface of the first die.
11. The apparatus according to claim 10 , wherein the at least one conductor is a through-mold via.
12. The apparatus according to claim 11 , wherein the first molding layer has thereon a compliant layer having a surface aligned to an end of the through-mold via.
13. The apparatus according to claim 11 , wherein a redistribution layer couples the at least one conductor for electrical conductivity with the second die.
14. The apparatus according to claim 11 , wherein the second die comprises fine-pitch contacts.
15. An apparatus, comprising:
a first die with a first molding layer along at least one side surface of the first die, a pad layer disposed over the first die and including at least one contact;
a second die with a second molding layer along at least one side surface of the second die, the second die directly bonded to the first die by way of a direct bonded interconnect, the second die including at least one contact directly bonded and in contact with the at least one contact of the pad layer without an intervening solder ball; and
at least one conductor through the first molding layer, the least one conductor being in contact with the second die.
16. The apparatus according to claim 15 , wherein the first die is a bridging die between the second die and a third die in the first molding layer.
17. The apparatus according to claim 16 , wherein the second die and the third die partially overlap a facing surface of the first die.
18. The apparatus according to claim 17 , wherein the at least one conductor is a through-mold via.
19. The apparatus according to claim 18 , wherein the first molding layer has thereon a compliant layer having a surface aligned to an end of the through-mold via.
20. The apparatus according to claim 18 , wherein a redistribution layer couples the at least one conductor for electrical conductivity with the second die.