Patent Assignment
Reel/Frame 060314/0827
Change of Name
Recorded: 2022-06-08
Pages: 5
Assignor
INVENSAS CORPORATION
Executed: 2021-10-01
Assignee
INVENSAS LLC
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Multi-Chip Modules Formed Using Wafer-Level Processing of a Reconstituted Wafer
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Dec 12, 2019
From: WANG, LIANG; KATKAR, RAJESH
To: INVENSAS CORPORATION
Reel/Frame 051267/0826 →
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Oct 23, 2025
From: INVENSAS LLC
To: ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
Reel/Frame 073238/0665 →