Patent Assignment
Reel/Frame 051268/0908
Assignment of Assignor's Interest
Recorded: 2019-12-12
Pages: 2
Assignee
SHINKO ELECTRIC INDUSTRIES CO., LTD.
80, OSHIMADA-MACHI, NAGANO-SHI, NAGANO, 381-2287, JAPAN
Covered Property
(1)
Adhesive Layer Bonding a Plurality of Substrates Having a Fillet Raised Portion