Patent Assignment
Reel/Frame 051330/0075
Assignment of Assignor's Interest
Recorded: 2019-12-19
Pages: 7
Assignors
KON, YOSHIMITSU
Executed: 2019-11-27
UTO, ATSUSHI
Executed: 2019-12-16
LI, LIFU
Executed: 2019-11-27
MIWA, TOMONORI
Executed: 2019-11-27
Assignee
TOKYO ELECTRON LIMITED
3-1, AKASAKA 5-CHOME, MINATO-KU,, TOKYO, 107-6325, JAPAN
Covered Property
(1)
Etching Method and Substrate Processing Apparatus