IP Library Assignment 051337/0522
Patent Assignment
Reel/Frame 051337/0522

Assignment of Assignor's Interest

Recorded: 2019-12-19 Pages: 5
Assignors
YADA, TAKAHIRO
Executed: 2019-12-19
TAKAIWA, TSUKASA
Executed: 2019-12-19
Assignee
J-DEVICES CORPORATION
1913-2 TAKEGASHITA FUKURA, USUKI-SHI, OITA, 875-0053, JAPAN
Covered Property (1)
Semiconductor Devices Including Shielding Layer and Methods of Manufacturing Semiconductor Devices
Application: 16/720,686 →
Publication: US 2021/0193587
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Aug 25, 2020
From: J-DEVICES CO., LTD.
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 053597/0184 →
Change of Name Feb 22, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 055362/0221 →
Corrective Assignment to Correct the Conveying Party Name Previously Recorded at Reel: 53597 Frame: 184. Assignor(S) Hereby Confirms the Assignment. Mar 5, 2021
From: J-DEVICES CORPORATION
To: AMKOR TECHNOLOGY JAPAN, INC.
Reel/Frame 055605/0060 →