Patent Assignment
Reel/Frame 051349/0783
Assignment of Assignor's Interest
Recorded: 2019-12-20
Pages: 4
Assignors
YANG, TAI-I
Executed: 2017-05-02
CHU, WEI-CHEN
Executed: 2017-05-02
LIU, HSIANG-WEI
Executed: 2017-05-02
SHUE, SHAU-LIN
Executed: 2017-05-02
SU, LI-LIN
Executed: 2017-05-02
WU, YUNG-HSU
Executed: 2017-05-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Metal Fill with Self-Aligned Patterning and Dielectric with Voids
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.