Patent Assignment
Reel/Frame 051350/0935
Assignment of Assignor's Interest
Recorded: 2019-12-20
Pages: 3
Assignors
WANG, CHIENHAO
Executed: 2019-12-20
LEE, BOB
Executed: 2019-12-20
CHIEN, YUHHARNG
Executed: 2019-12-20
Assignee
TEXAS INSTRUMENTS INCORPORATED
12500 TI BOULEVARD, M/S 3999, DALLAS, TEXAS, 75243
Covered Property
(1)
Semiconductor Package Substrate with a Smooth Groove About a Perimeter of a Semiconductor Die