IP Library Assignment 051358/0938
Patent Assignment
Reel/Frame 051358/0938

Assignment of Assignor's Interest

Recorded: 2019-12-23 Pages: 7
Assignors
ZHAO, SAM ZIQUN
Executed: 2017-10-23
TSAU, LIMING
Executed: 2017-10-23
LAW, EDWARD
Executed: 2017-10-23
BROTMAN, ANDY
Executed: 2017-10-23
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property (1)
Redistribution Metal and Under Bump Metal Interconnect Structures and Method
Application: 16/700,528 →
Publication: US 2020/0105698
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Merger Dec 23, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 051414/0991 →