Patent Assignment
Reel/Frame 051358/0938
Assignment of Assignor's Interest
Recorded: 2019-12-23
Pages: 7
Assignors
ZHAO, SAM ZIQUN
Executed: 2017-10-23
TSAU, LIMING
Executed: 2017-10-23
LAW, EDWARD
Executed: 2017-10-23
BROTMAN, ANDY
Executed: 2017-10-23
Assignee
AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property
(1)
Redistribution Metal and Under Bump Metal Interconnect Structures and Method
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.