IP Library › Assignment 051414/0991
Patent Assignment
Reel/Frame 051414/0991

Merger

Recorded: 2019-12-23 Pages: 2
Assignor
Assignee
AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
1 YISHUN AVENUE 7, SINGAPORE, 768923, SINGAPORE
Covered Property (1)
Redistribution Metal and Under Bump Metal Interconnect Structures and Method
Application: 16/700,528 →
Publication: US 2020/0105698
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 23, 2019
From: ZHAO, SAM ZIQUN; TSAU, LIMING; LAW, EDWARD; BROTMAN, ANDY
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 051358/0938 →