Patent Assignment
Reel/Frame 051376/0195
Assignment of Assignor's Interest
Recorded: 2019-12-27
Pages: 2
Assignor
CHEN, HSIEN-WEI
Executed: 2012-11-06
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Method of Making Package Assembly Including Stress Relief Structures