Method of making package assembly including stress relief structures

1. A method comprising:

bonding a plurality of dies to a substrate, wherein a first die of the plurality of dies is larger than a second die of the plurality of dies;

adhering a first stress relief structure to the substrate, wherein a distance between the first stress relief structure to a closest die of the plurality of dies to the first stress relief structure is a first distance; and

adhering a second stress relief structure to the substrate, wherein a distance between the second stress relief structure to a closest die of the plurality of dies to the second stress relief structure is the first distance, and the first stress relief structure is discontinuous with respect to the second stress relief structure.

2. The method of claim 1 , wherein adhering the first stress relief structure to the substrate comprises adhering the first stress relief structure along a first edge of the substrate.

3. The method of claim 2 , wherein adhering the second stress relief structure to the substrate comprises adhering the second stress relief structure along a second edge of the substrate, and the second edge is perpendicular to the first edge.

4. The method of claim 2 , wherein adhering the second stress relief structure to the substrate comprises adhering the second stress relief structure along a second edge of the substrate, and the second edge is parallel to the first edge.

5. The method of claim 1 , further comprising adhering a third stress relief structure to the substrate, wherein the third stress relief structure is adhered to the substrate between the first die and the second die.

6. The method of claim 1 , wherein adhering the first stress relief structure to the substrate comprises adhering the first stress relief structure having a shape selected from the group consisting of a rectangle, an L-shape, a T-shape, a broken strip, a rectangular array, a cross, a square, a triangle, a circle and a polygon.

7. The method of claim 1 , wherein adhering the first stress relief structure to the substrate comprises adhering the first stress relief structure at a first corner of the substrate.

8. A package comprising:

a substrate;

a plurality of dies on the substrate, wherein a first die of the plurality of dies is larger than a second die of the plurality of dies;

a first stress relief structure on the substrate, wherein a distance between the first stress relief structure to the first die is a first distance; and

a second stress relief structure on the substrate, wherein a distance between the second stress relief structure to a closet die of the plurality of dies is the first distance, and the second stress relief structure is separated from the first stress relief structure.

9. The package of claim 8 , wherein the first stress relief structure extends along a first edge of the substrate.

10. The package of claim 9 , wherein the second stress relief structure extends along a second edge of the substrate, and the second edge is perpendicular to the first edge.

11. The package of claim 9 , wherein the second stress relief structure extends along a second edge of the substrate, and the second edge is parallel to the first edge.

12. The package of claim 8 , further comprising a third stress relief structure on the substrate, wherein the third stress relief structure is between the first die and the second die.

13. The package of claim 8 , wherein the first stress relief structure has a shape selected from the group consisting of a rectangle, an L-shape, a T-shape, a broken strip, a rectangular array, a cross, a square, a triangle, a circle and a polygon.

14. The package of claim 8 , wherein the first stress relief structure is at a first corner of the substrate.

15. The package of claim 8 , wherein a third die of the plurality of dies is larger than the second die.

16. The package of claim 15 , further comprising:

a third stress relief structure between the first die and the third die; and

a fourth stress relief structure between the first die and the second die, wherein the third stress relief structure is separate from the fourth stress relief structure.

17. The package of claim 15 , further comprising a third stress relief structure, wherein the third stress relief structure is between the first die and the second die, the third stress relief structure is between the second die and the third die, and the third stress relief structure is a continuous structure.

18. A package comprising:

a substrate;

a first die on the substrate, wherein the first die has a first size;

a second die on the substrate, wherein the second die has a second size different from the first size;

a third die on the substrate, wherein the third die has a third size different from the first size; and

a plurality of edge stress relief structures, wherein each of the plurality of edge stress relief structures is discontinuous with respect to each other of the plurality of edge stress relief structures, and a distance between the first die and a first edge stress relief structure of the plurality of edge stress relief structures is equal to a distance between the second die and a second edge stress relief structure of the plurality of edge stress relief structures.

19. The package of claim 18 , further comprising a continuous interior stress relief structure, wherein the continuous interior stress relief structure is between the first die and the second, and the continuous interior stress relief structure is between the first die and the third die.

20. The package of claim 18 , further comprising a plurality of interior stress relief structures, wherein each of the plurality of interior stress relief structures is discontinuous with respect to each other of the plurality of interior stress relief structures, a first interior stress relief structure of the plurality of interior stress relief structures is between the first die and the second die, and a second interior stress relief structure of the plurality of interior stress relief structures is between the second die and the third die.