Semiconductor package structure
A semiconductor package structure includes a base having a first surface and a second surface opposite thereto, wherein the base comprises a wiring structure, a first electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, a second electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, wherein the first electronic component and the second electronic component are separated by a molding material, a first hole and a second hole formed on the second surface of the base, and a frame disposed over the first surface of the base, wherein the frame surrounds the first electronic component and the second electronic component.
1 . A semiconductor package structure, comprising:
a base having a first surface and a second surface opposite thereto, wherein the base comprises a wiring structure;
a first electronic component disposed over the first surface of the base and electrically coupled to the wiring structure;
a second electronic component disposed over the first surface of the base and electrically coupled to the wiring structure, wherein the first electronic component and the second electronic component are separated by a molding material;
a first hole and a second hole formed on the second surface of the base, wherein the first hole and the second hole are penetrated through the wiring structure; and
a frame disposed over the first surface of the base, wherein the frame surrounds the first electronic component and the second electronic component.
2 . The semiconductor package structure as claimed in claim 1 , wherein the first hole is covered by the first electronic component, and the second hole is covered by the second electronic component.
3 . The semiconductor package structure as claimed in claim 1 , wherein the first hole and the second hole are disposed closer to a center line between the first electronic component and the second electronic component than an edge of the base.
4 . The semiconductor package structure as claimed in claim 1 , wherein the first hole and the second hole have rectangular shapes or circular shapes from a plane view.
5 . The semiconductor package structure as claimed in claim 1 , further comprising:
a third hole and a fourth hole formed on the second surface of the base, wherein the third hole is covered by the first electronic component, and the fourth hole is covered by the second electronic component, and
wherein the first hole, the second hole, the third hole and the fourth hole are arranged radially around a center of the base.
6 . The semiconductor package structure as claimed in claim 1 , further comprising:
a third hole and a fourth hole formed on the second surface of the base, wherein the third hole is covered by the first electronic component, and the fourth hole is covered by the second electronic component, and
wherein the first hole and the third hole are arranged in a first array, and the second hole and the fourth hole are arranged in a second array, the first array and the second array are parallel to a center line between the first electronic component and the second electronic component.
7 . The semiconductor package structure as claimed in claim 6 , further comprising:
a fifth hole and a sixth hole formed on the second surface of the base, wherein the fifth hole is covered by the first electronic component, and the sixth hole is covered by the second electronic component, and
wherein the first hole, the third hole and the fifth hole are staggered along a direction of the center line, and the second hole, the fourth hole and the sixth hole are staggered along the direction of the center line.
8 . The semiconductor package structure as claimed in claim 1 , further comprising:
a plurality of conductive structures disposed over the first surface and below the first electronic component and the second electronic component; and
a plurality of bump structures disposed over the second surface of the base, wherein the first electronic component and the second electronic component are electrically coupled to the bump structures through the conductive structures and the wiring structure in the base.
9 . The semiconductor package structure as claimed in claim 1 , wherein the molding material further surrounds the first electronic component and the second electronic component, and surfaces of the first electronic component and the second electronic component facing away from the base are exposed by the molding material.
10 . The semiconductor package structure as claimed in claim 1 , further comprising:
a stress buffer layer filled into the first hole and the second hole.
11 . A semiconductor package structure, comprising:
a base having a wiring structure;
a first electronic component disposed over the base and electrically coupled to the wiring structure;
a second electronic component disposed over the base and electrically coupled to the wiring structure, wherein the first electronic component and the second electronic component are arranged side-by-side;
holes formed on a surface of the base, wherein the holes are located within a projection of the first electronic component or the second electronic component on the base; and
a molding material, surrounding the first electronic component and the second electronic component, and surfaces of the first electronic component and the second electronic component facing away from the base are exposed by the molding material.
12 . The semiconductor package structure as claimed in claim 11 , wherein the holes have rectangular shapes or circular shapes from a plane view.
13 . The semiconductor package structure as claimed in claim 11 , wherein the holes are arranged in arrays that are parallel to a center line between the first electronic component and the second electronic component.
14 . The semiconductor package structure as claimed in claim 11 , wherein the holes are arranged radially around a center, and the center is located between the first electronic component and the second electronic component.
15 . The semiconductor package structure as claimed in claim 11 , wherein the holes are staggered along a direction parallel to a center line between the first electronic component and the second electronic component.
16 . The semiconductor package structure as claimed in claim 11 , wherein the holes are located close to a center of the base.
17 . The semiconductor package structure as claimed in claim 11 , wherein the holes are located along a peripheral edge of the base.
18 . The semiconductor package structure as claimed in claim 11 , wherein the holes are symmetrically located about a center line between the first electronic component and the second electronic component.
19 . The semiconductor package structure as claimed in claim 11 , further comprising:
a stress buffer layer filled into the holes, wherein the stress buffer layer is made of a polymer material.
20 . A base structure, comprising:
a wiring structure disposed in a base, wherein the wiring structure is coupled to a plurality of electronic components disposed over the base; and
a plurality of holes formed on a surface of the base, wherein the holes are penetrated through the wiring structure, wherein the holes are located within projections of the electronic components on the base, wherein the holes have rectangular shapes or circular shapes from a plane view.