Patent Assignment
Reel/Frame 051387/0747
Assignment of Assignor's Interest
Recorded: 2019-12-30
Pages: 6
Assignors
JUNG, KYOOHO
Executed: 2019-10-24
SONG, JEONGGYU
Executed: 2019-10-24
KIM, YOUNSOO
Executed: 2019-10-28
LEE, JOOHO
Executed: 2019-10-28
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device and Method of Manufacturing the Same