Patent Assignment
Reel/Frame 051396/0797
Assignment of Assignor's Interest
Recorded: 2020-01-02
Pages: 10
Assignors
WANG, HUI-LIN
Executed: 2019-12-30
HSU, PO-KAI
Executed: 2019-12-30
CHEN, HUNG-YUEH
Executed: 2019-12-30
WANG, YU-PING
Executed: 2019-12-30
Assignee
UNITED MICROELECTRONICS CORP.
NO.3, LI-HSIN ROAD 2, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU CITY, TAIWAN
Covered Property
(1)
Semiconductor Device and Method for Fabricating the Same