Patent Assignment
Reel/Frame 051405/0596
Assignment of Assignor's Interest
Recorded: 2020-01-02
Pages: 8
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same