Patent Assignment
Reel/Frame 051405/0639
Assignment of Assignor's Interest
Recorded: 2020-01-02
Pages: 3
Assignor
LEE, CHIH CHENG
Executed: 2019-11-29
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package Having a Core Substrate and an Embedded Component in the Core Substrate