IP Library Assignment 051406/0599
Patent Assignment
Reel/Frame 051406/0599

Assignment of Assignor's Interest

Recorded: 2020-01-03 Pages: 4
Assignors
SAID, RAMY NASHED BASSELY
Executed: 2019-12-19
KANAKAMEDALA, SENAKA
Executed: 2019-12-19
ZHOU, FEI
Executed: 2019-12-19
MAKALA, RAGHUVEER S.
Executed: 2019-12-19
LEE, YAO-SHENG
Executed: 2019-12-19
Assignee
SANDISK TECHNOLOGIES LLC
5080 SPECTRUM DRIVE, SUITE 1050W, ADDISON, TEXAS, 75001
Covered Property (1)
Semiconductor Device Containing Metal-Organic Framework Inter-Line Insulator Structures and Methods of Manufacturing the Same
Application: 16/722,824 →
Publication: US 2021/0193585
Related Assignments (3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 31, 2024
From: SANDISK TECHNOLOGIES LLC
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 069796/0423 →
Security Agreement Apr 25, 2025
From: SANDISK TECHNOLOGIES, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 071050/0001 →
Partial Release of Security Interests Apr 25, 2025
From: JPMORGAN CHASE BANK, N.A., AS AGENT
To: SANDISK TECHNOLOGIES, INC.
Reel/Frame 071382/0001 →