Patent Assignment
Reel/Frame 051429/0700
Assignment of Assignor's Interest
Recorded: 2020-01-06
Pages: 4
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Electrical Connection Placement of Semiconductor Device Package and Method of Manufacturing the Same