Patent Assignment
Reel/Frame 051438/0766
Assignment of Assignor's Interest
Recorded: 2020-01-07
Pages: 6
Assignors
CHANG, JIE
Executed: 2018-01-02
CHEN, HUIBIN
Executed: 2018-01-02
MALDO, TIBURCIO
Executed: 2018-01-04
LEE, KEUNHYUK
Executed: 2018-01-02
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property
(1)
Press-Fit Power Module and Related Methods
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
Release of Security Interest in Patents Recorded at Reel 052656, Frame 0842
Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →