Patent Assignment
Reel/Frame 051456/0805
Assignment of Assignor's Interest
Recorded: 2020-01-08
Pages: 5
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package Having Thermal Conductive Pattern Surrounding Semiconductor Die